Ni-P和Ni-Cu-P化学镀层对比研究  

Contrast of E1ectroless Plating Ni-P and Ni-Cu-P Deposits

作　　者：赵芳霞[1] 刘琛[2] 张振忠[1] 丘泰[1] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009 [2]陕西理工学院,陕西汉中723001

出　　处：《材料保护》2006年第3期65-68,共4页Materials Protection

基　　金：江苏省高校自然科学研究计划(03KJB430045;05KJB1300421);陕西省自然科学基金(2003E120)

摘　　要：利用SEM、DSC、XRD、中性盐雾试验和显微硬度分析等手段,对Ni10.54%P及Ni9.25%Cu10.23%P化学镀层的组织特征、相结构转变、热稳定性、耐蚀性和硬度进行了比较。结果表明:(1)两种镀层均匀致密,均为胞状结构和非晶态组织;(2)NiP镀层仅发生从非晶相向稳定的Ni3P相转变,而NiCuP镀层则先生成NiCu固溶体和亚稳中间相Ni5P2,再向稳定相Ni3P转变;(3)NiCuP镀层的热稳定性高于NiP镀层;(4)镀态和低温热处理条件下两种镀层的硬度相差不大,NiP镀层经400℃、60min热处理时硬度达到最高值981.1HV,但NiCuP镀层经500℃、60min热处理时硬度达到最高值1144.8HV;(5)镀态时NiCuP镀层的腐蚀速率只有NiP镀层腐蚀速率的2.85%;经过400℃、120min相同条件的热处理,NiCuP镀层的腐蚀速率仅为NiP镀层腐蚀速率的0.351%。Microstructures, crystallization behaviors, thermal stabilities, hardness, and corrosion resistances of electroless plating Ni-10.54%P and Ni-9.25%Cu 10.23%P deposits were contrastively studied by using SEM, DSC, XRD, neutral salt spray and micro-hardness analysis. Results indicate that both as-plated deposits are compact and symmetrical, and all exhibit a cell structure and amorphous structure. It only occurs Ni_3P stable phase transformation from amorphous for Ni-P deposit during crystallization, but first forms Ni-Cu solid solution and Ni_5P_2 metastable phase and then transform to Ni_3P stable phase for Ni-Cu-P deposit. The thermal stability of Ni-Cu-P deposit is higher than Ni-P deposit. The hardness of both deposits is similar in as-plated and heat-treated under lower temperatures. The hardness of Ni-P deposit reaches the maximum 981.1 HV after treated under 400 ℃for 60 minutes, but that of Ni-Cu-P deposit reaches the maximum 1 144.8 HV. The corrosion rate of Ni-Cu-P deposit is only 2.85% of the Ni-P deposit in as-plated state, and is only 3.51‰ of the Ni-P deposit while both treated under 400 ℃ for 120 minutes.

关 键 词：化学镀 NI-P NI-CU-P 热稳定性 硬度 耐蚀性 

分 类 号：TG174.44[金属学及工艺—金属表面处理]