快速光亮化学镀镍工艺  

High Speed Bright Electroless Nickel Plating

作　　者：何向辉[1] 刘彦哲[1] 顾耀前 郑振[1] 

机构地区：[1]上海应用技术学院化学工程系,上海200235 [2]上海金杨金属表面处理有限公司,上海200137

出　　处：《电镀与环保》2006年第2期24-26,共3页Electroplating & Pollution Control

摘　　要：弱酸性化学镀镍溶液体系采用复合配位剂以及一种添加剂，在80-90℃范围内可获得光亮镍磷合金镀层，沉积速率可迭20μm／h。研究了温度、pH值及镀液成份对化学镀镍层沉积速率的影响，并讨论了镀液的稳定性及添加剂的作用。A bright Ni-P alloy coating can be obtained within a temperature range of 80 - 90℃ with a depositing rate up to 20 μm/h from weak acidic electroless Ni plating bath system containing a composite complexing agent and a special additive. The effects of temperature, pH and bath ingredients on the rate of electroless nickel deposition are studied, and the stability of the bath and the roles of the additives are also discussued.

关 键 词：化学镀镍磷合金 快速 光亮 

分 类 号：TQ153[化学工程—电化学工业]