粗真空条件下锡基钎料与Sialon陶瓷的润湿和连接  

WETTING AND JOINING OF Sn-BASED ACTIVE SOLDERS ON SIALON CERAMIC IN ROUGH VACUUM

作　　者：庄艳歆[1] 冼爱平[1] 王仪康[1] 张修睦[1] 胡壮麒[1] 

机构地区：[1]中国科学院金属研究所

出　　处：《金属学报》1996年第7期735-741,共7页Acta Metallurgica Sinica

基　　金：863青年组科研基金

摘　　要：采用座滴法和四点弯曲方法研究了粗真空条件下锡基钎料在Ｓｉａｌｏｎ陶瓷上的润湿性和连接强度．在１Ｐａ，１１７３Ｋ，２０ｍｉｎ的实验条件下，锡基钎料的静态润湿角小于２０°．加入Ｚｎ，Ｐｂ后，钎料钎焊Ｓｉａｌｏｎ／Ｓｉａｌｏｎ陶瓷时的接头连接强度有明显提高，Ｓｎ－５Ｃｕ－５Ｔｉ，Ｓｎ－５Ｃｕ－５Ｔｉ－２０Ｚｎ，Ｓｎ－５Ｃｕ－５Ｔｉ－１０Ｐｂ的平均接头连接强度分别为９０．８，１５３．４，１６９．１ＭＰａ；最高接头连接强度分别为１１９．８，２００，２１６．７ＭＰａ．在粗真空条件下锡基钎料可以实现陶瓷的良好连接，且接头残余应力较小．本文首次观察到锡基钎料中挥发性组元Ｚｎ对粗真空条件下润湿前驱膜有明显的影响．对临界润湿温度、粗真空条件下第三组元的作用及这种活性钎料的潜在应用价值进行了讨论．The sessile drop method and four points bending test were used to study the wettability and joining strength of Sn-based solders on Sialon substrates. Under vacuum of 1.33 Pa and holding 20 min at 1173 K, the contact angle of Sn-based is lower than 20 degree,while the joining strength of the soldering joints on rough vacuum may be markedly improved with the addition of zinc or lead, The average joining strength of Sialon/Sialon joints, soldered with Sn-5Cu-STi, Sn-5Cu-5Ti-20Zn, Sn-5Cu-5Ti-10Pb, are 90.8, 154.3 and 169.1 MPa respectively. And the maximums of joining strength are respectively 119.8, 200 and 216.1 MPa for three solders. In rough vacuum, Sn-based active solders may finish the joining of Sialon/Sialon, and the residual stress is reduced. On the other hand, alloy component zinc in Sn-based solders obviously affects precursor film in rough vacuum.

关 键 词：粗真空 润湿 连接 陶瓷 钎料 锡基合金 

分 类 号：TG425.1[金属学及工艺—焊接]