碳纳米管表面的无钯活化化学镀镍研究  

Electroless Nickel Plating on Carbon Nanotube with Non-palladium Activation Procedure

作　　者：胡光辉[1] 吴辉煌[1] 杨防祖[1] 

机构地区：[1]厦门大学化学化工学院固体表面物理化学国家重点实验室,福建厦门361005

出　　处：《电化学》2006年第1期25-28,共4页Journal of Electrochemistry

基　　金：国家自然科学基金(20073035)资助

摘　　要：本文提出碳纳米管表面无钯活化的化学镀镍方法.碳纳米管经硝酸氧化和碱中和后表面生成羧基,利用羧基吸附镍离子,之后吸附的镍离子被化学还原为镍的纳米微粒并成为化学镀镍的催化活性中心.红外吸收光谱和电子显微镜观察等证实了上述活化过程的机理.实验表明,新的活化方法对碳纳米管表面化学镀是切实可行的,文中同时对化学沉积层的不同形貌进行讨论.A new procedure of surface activation without using palladium salt was proposed for electroless nickel plating on carbon nanotubes. In the procedure, carbon nanotubes were oxidized by nitric acid and then neutralized with NaOH to create carboxyl surface groups which were used to adsorb Ni^2＋ ions, thereafter the adsorbed Ni^2＋ ions were chemically reduced into Ni nano-particles as a catalytic center for electroless nickel deposition, all these were further confirmed by infrared absorption spectra and electron microscopic observations. The results indicate that the procedure is feasible to electroless nickel plating on carbon nanotubes. The different morphology of deposits obtained from electroless plating was also discussed.

关 键 词：碳纳米管 表面活化 化学镀镍 

分 类 号：TQ153[化学工程—电化学工业]