混合式非致冷红外焦平面列阵发展状况  

Development status quo of HUIRFPAs

作　　者：程开富[1] 

机构地区：[1]重庆光电技术研究所

出　　处：《半导体光电》1996年第3期212-217,共6页Semiconductor Optoelectronics

摘　　要：将热释电探测器与硅多路传输器用铟柱互连，即可实现混合式非致冷红外焦平面阵列。The hybrid uncooled infrared focal plane arrays (HUIRFPAs) is realized by combining the pyroelectric detector with silicon multiplexer in terms of indium bump bonds. This paper mainly desscribes the typical structures and the status quo of development of HUIRFPA.

关 键 词：红外探测器 硅多路传输器 焦平面阵列 热释电器 

分 类 号：TN215[电子电信—物理电子学]