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作 者:印仁和[1] 董晓明[1] 曹为民[1] 张利[1]
出 处:《电镀与涂饰》2006年第4期5-7,共3页Electroplating & Finishing
基 金:厦门大学固体表面化学国家重点实验室资助项目
摘 要:首次利用现场表面增强拉曼光谱研究了Zn-Ni合金共沉积的机理。通过研究Ni电极在NiCl2溶液与纯水中的拉曼光谱、Ni电极与Au电极在KCl溶液中的拉曼光谱以及这2种电极在NiCl2溶液中现场电沉积的拉曼光谱,并根据前人提出的理论,得出如下结论:Zn-Ni合金共沉积中存在着较易在电极表面放电的NiClad,使Ni沉积的过电位降低,促进了Ni的沉积,导致Zn的异常共沉积。The mechanism of Zn-Ni alloy codeposition was studied firstly through in situ surface enhanced raman spectrum (SERS). The SERS of Ni electrode in NiCl2 solution and pure water, the SERS of Ni electrode and Au electrode in KCI solution and the in situ electrodeposition SERS of the two kinds of electrodes in NiCl2 solution were discussed. On the basis of the theory put forward by predecessors, the following conclusions were suggested: NiClad exists in the codeposition of Zn-Ni alloy, which is easy to discharge on the electrode surface, thus lowering the overpotential of Ni deposition, and as a result Ni deposition is promoted leading to the abnormal codeposition of Zn.
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