DKJ-Ⅰ型大片玻璃打孔机  

Model DKJ-I Drilling Machine for Large Glass Wafers

作　　者：陆宏[1] 孙富[1] 

机构地区：[1]沈阳仪器仪表工艺研究所,沈阳市110043

出　　处：《仪表技术与传感器》1996年第3期17-19,共3页Instrument Technique and Sensor

摘　　要：大片玻璃打孔机是一台硅压力传感器的生产设备。文章介绍了该设备的加工机理、设计原则、机床结构和技术指标;结合设备所采用的超声波多工具钻孔技术;解决的关键技术和整机的实用效果。The drilling machine for large glass wafer processing is a production machine for silicon pressure sensors. This paper introduces the operating theory, design principle, mechanical structure and technical specifications. In combination with the ultrasonic multi-tooling techniques, the key problems tackled in the research and the practical application of the machine are also presented.

关 键 词：传感器 超声波应用 玻璃打孔机 

分 类 号：TQ171.68[化学工程—玻璃工业]