振动精抛磨块的制备工艺研究  

Preparation of finish grinding chips for vibrating polishing special shaped parts

作　　者：杨乾华[1] 

机构地区：[1]西南科技大学制造科学与工程学院,四川绵阳621010

出　　处：《金刚石与磨料磨具工程》2006年第2期74-76,共3页Diamond & Abrasives Engineering

基　　金：国家863高科技资助项目(2002AA421220)

摘　　要：振动抛光韧而粘的异型曲表面零件是目前较为理想的光整加工方法之一,其关键之一在于抛光磨块的合理制备。采用白刚玉(WA)和立方氮化硼(CBN)混合磨料与陶瓷结合剂、用粉末冶金的方法,配以适当的烧结制度烧制而成的振动精抛专用磨块,单向振动和三维振动抛光试验表明,该类磨块用于振动抛光钛合金、不锈钢和铝合金等材料的工件表面,效果明显,表面粗糙度数值可达Ra 0.1μm,抛光效率可提高约三倍。Abrasive chips for vibration polishing of tough,special shaped workpieces were prepared by using metallurgy method. Mixed abrasive grains（ white alumina and cubic boron nitride） and vitrified bond were adopted. The one-way vibration and triaxial vibration test indicate that, when vibrating polishing titanium alloy, stainless steel and aluminum alloy workpieces, the effect of polishing materials is evident. The roughness of surface of the workpieces can reach 0. 1μm, and the efficiency can be raised by 3 times.

关 键 词：振动抛光 磨块 磨料 陶瓷结合剂 

分 类 号：TG74[金属学及工艺—刀具与模具]