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作 者:梁清香[1] 牛学仁[1] 李雷[1] 杨自学[2]
机构地区:[1]太原科技大学,太原030024 [2]北京南口机车车辆机械厂,北京102202
出 处:《太原科技大学学报》2006年第2期124-126,共3页Journal of Taiyuan University of Science and Technology
摘 要:用有限元软件MARC建立了具有脱层和无脱层的两端固支层合板模型,并进行了模态分析。文中分别研究了双金属粘接、复合材料与金属粘接、复合材料与复合材料粘接三种类型的层合板脱层对其固有频率的影响,并绘制了脱层与固有频率关系曲线图,为工程应用提供了科学依据。In this paper, the lamination board models with fixed ends were established with MARC and the mode analysis was carried on. The bimetal cementation, the compound material and the metal cementation, the compound material and the compound material cementation three types of lamination boards delaminates on its natural frequency had been separately studied and delaminating with the natural frequency relations diagram of curves had been drawn up.
分 类 号:O327[理学—一般力学与力学基础]
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