脉冲电镀铁中平均电流密度对镀层的影响  

Effect of Average Electric Current Density on Deposition Rate and Appearance and Structure of Pulse Electrodeposited Fe Coating

作　　者：徐金霞[1] 蒋林华[1] 刘大智[1] 陈施英[1] 冯文生[1] 

机构地区：[1]河海大学材料科学与工程系,江苏南京210098

出　　处：《材料保护》2006年第4期13-15,共3页Materials Protection

摘　　要：应用现代脉冲电镀技术,分别在钢和铜基体上电镀铁层,以期获得性能优良的镀层。研究了平均电流密度对铁镀层的沉积速度、外貌、显微硬度和显微结构的影响。结果显示:随着平均电流密度的增加,铁镀层外貌先变好后变差;脉冲电沉积速度加快,以16A/dm2的沉积效率最高;不同条件下的镀层显微硬度呈近似的“正态分布”关系;铁镀层的显微结构为立方晶型,有明显的择优取向。Iron coatings were prepared on steel and copper substrates using pulse electrodeposition technique. The influence of the average current density on the deposition rate and appearance, microhardness, and microstructure of the as-deposited Fe coating was investigated. As the results, the Fe coating had satisfactory appearance in the early stage of increasing of the average current density, but the appearance became poor with extended increasing of the current density. At the same time, the deposition rate of the iron coating increased with increasing current density and the best deposition efficiency was reached at a current density of 16 A/ dm 2. Moreover, the microhardness of the Fe coatings prepared at different deposition conditions was roughly characterized by Gaussian distribution, while the cubic crystal of the Fe coating had obvious preferred orientation.

关 键 词：脉冲电镀 平均电流密度 铁镀层 显微硬度 结合力 显微结构 

分 类 号：TQ153[化学工程—电化学工业]