热固性复合材料固化过程中温度场的三维有限元分析  

Three-dimensional finite element analysis for the temperature field of thermoset composites during cure process

作　　者：张纪奎[1] 关志东[1] 郦正能[1] 

机构地区：[1]北京航空航天大学航空科学与工程学院飞机系,北京100083

出　　处：《复合材料学报》2006年第2期175-179,共5页Acta Materiae Compositae Sinica

基　　金："凡舟"基金资助项目(20050504)

摘　　要：根据热传导和固化动力学理论,采用三维有限元方法,对正交各向异性复合材料层合板固化过程的温度和固化度历程及其变化规律进行数值模拟研究。在有限元分析中节点自由度为温度和固化度,考虑了两者之间的耦合作用。计算结果表明:厚度越大,温度峰值越高,中心点开始固化越晚;不同纤维体积含量层合板在固化初期是同步的;中心点温度超过保温平台(85℃)后,随着环境温度继续升高,纤维体积含量越低,中心点温度峰值越大,出现时间越早。Based on the thermal conduct theory and cure kinetics, the history ot cure temperature ano degree oI cure was investigated for the orthotropic laminate during curing. The temperature and degree of cure were chosen as two additional degrees of nodes in FEM models, and the coupling of them was taken into account. The result shows that ： for the thick laminate, the peak value of the temperature was increased, and the initiation of the crosslinking reaction at the center point was late; for the laminates with different fiber contents, the development of the degree of cure is synchronic at the early stage of the curing process, when the temperature is higher than that of the dwell （85℃）, the lower the fiber content in the laminates, the higher the peak value of temperature at the center of the laminates , and its corresponding time is quicker.

关 键 词：热固性复合材料 固化温度 固化度 有限元分析 

分 类 号：TB330.1[一般工业技术—材料科学与工程]