铜含量对Sn-Cu钎料与Cu、Ni基板钎焊界面IMC的影响  

Effect of Cu content on IMC between Sn-Cu solder and Cu and Ni substrates

作　　者：何大鹏[1] 于大全[1] 王来[1] C M L Wu 

机构地区：[1]大连理工大学材料科学与工程学院,大连116023 [2]香港城市大学物理与材料科学系

出　　处：《中国有色金属学报》2006年第4期701-708,共8页The Chinese Journal of Nonferrous Metals

基　　金：辽宁省自然科学基金(20041078);大连理工大学青年教师基金

摘　　要：研究了不同铜含量的Sn—xCu钎料（x=0，0．1％，0．3％，0．7％，0．9％，1．5％）与Cu板和Ni板在260、280和290℃钎焊后界面金属间化合物（IMC）的成分和形貌。研究结果表明：钎料与Cu板钎焊时，钎焊温度越高，界面处形成的Cu6Sn5 IMC厚度越大，而在同一钎焊温度下，随着钎料中铜含量的增加，IMC的厚度先减少后增加；与Ni板钎焊时，界面IMC的厚度随着铜含量的增加而增加，同时界面化合物的成分和形貌均发生了显著变化；当Cu含量小于0．3％（质量分数）时，界面处形成了连续的（CuxNi1-x）3Sn4层；而当Cu含量为0．7％时，界面处同时存在着短棒状（CuxNi1-x）3Sn4和大块状（CuxNi1-x）6Sn5IMC；当铜含量继续增大时（0．9％～1．5％），（CuxNi1-x）3Sn4IMC消失，只发现了棒状（CuxNi1-x）6Sn5IMC。讨论了钎料中Cu含量对与Cu、Ni基板钎焊接头界面化合物生长的影响，并进一步讨论了（CuxNi1-x）6Sn5IMC的形成和长大机理。The reactions between Sn-xCu（x=0, 0. 1%, 0.3%, 0. 7%, 0.9%, 1.5%） and Cu or Ni at 260, 280 and 290 ℃ were studied to reveal the effect of varying Cu content on the composition and morphologies of intermetallic compounds （IMC） formed at the interface between solders and the substrate. The IMCs formed at the interface of Sn-Cu/Cu are Cu6Sn5. The higher the temperature is, the thicker the IMC layer forms. While soldering at the same temperature, with the increase of Cu content the thickness of IMC reduces first then increases. The thickness of IMC increases with the increase of Cu content when soldered with Ni at 260℃. And at the same time, the composition and morphologies of the IMC have notable changes. When the Cu content is below 0. 3 % （mass fraction）, a continuous （CuxNi1-x）3Sn4 IMC layer formed at the interface. When the Cu content is 0. 7%, bigger facet （CuxNi1-x）6Sn5 IMCs are found on the （CuxNi1-x）3Sn4 IMC layer. At higher Cu content （0.9%- 1.5%）, stick shaped （CuxNi1-x）6Sns IMCs are detected and （CuxNi1-x）3Sn4 IMCs disappear. The effect of Cu content on the growth of IMC layer is analyzed and the formation and growth mechanisms of （CuxNi1-x）6Sn5 IMC are discussed further.

关 键 词：Sn—Cu钎料 金属间化合物(IMC) 钎焊 界面反应 

分 类 号：TG425.1[金属学及工艺—焊接]