异步叠轧铜板的再结晶研究  

Recrystallization of copper sheets produced by means of AARB

作　　者：吴承玲[1] 史庆南[1] 王军丽[1] 张坤华[1] 

机构地区：[1]昆明理工大学,云南昆明650093

出　　处：《南方金属》2006年第2期10-12,共3页Southern Metals

基　　金：云南省自然科学基金重点项目(2003E0003Z)

摘　　要：对七道次异步叠轧铜板采用220℃×30 m in和220℃×40 m in两种退火工艺,运用背散射电子衍射技术(EBSD)对两种铜板的再结晶程度、极图和织构进行了研究.结果表明:采用220℃×40 m in退火工艺的铜板再结晶较完全,其织构为明显的{100}〈001〉立方织构;而采用220℃×30 m in退火工艺的铜板内仍存在晶体缺陷,其织构为{123}〈412〉轧制织构,及少量的{100}〈001〉立方织构.The recrystallization degree, texture and pole figures of copper sheets fabricated by means of a 7 pass asynchronous accumulative wiling-bonding （AARB） technique and recrystallized at 220℃ for 30 min and 40min respectively were investigated using electron backscatter diffraction （EBSD）. It was found that a complete recrystallization occurred in the material annealed at 220℃ for 40 min, with at 100t （001）cubic texture produced in it, whereas striking crystal defects remained in the material annealed at 220℃ for 30 min, with a major{ 123 } 〈412〉 rolling texture and a minor{ 100 } 〈001〉 cubic texture formed in it.

关 键 词：异步叠轧 铜板 再结晶 背散射电子衍射 

分 类 号：TG111.7[金属学及工艺—物理冶金]