脉冲电镀中的电流分布  

Current Distribution in Pulse Plating

作　　者：刘伯生[1] 

机构地区：[1]南昌航空学院

出　　处：《表面技术》1990年第3期8-14,共7页Surface Technology

摘　　要：在定性考察电流分布基本概念和主要影响因素的基础上,从理论和实验上描述了具有脉动电流的电流分布,结果表明脉动对首次电流分布没有影响,而是使二次电流分布变得不如直流电镀时均匀。如果沿着电极表面的脉动扩散层厚度恒定,则与直流电镀相比,由于采用脉冲电镀而使三次电流分布得到改善。The conception of current distribution and the main factors influncing the distribution of the current over an electrode surface was considered, It has described theoretically and experimentally the current distribution with pulsating current, The results show that pulse plating does not affect primary current distribution, while it renders the secondary one less uniform than with DC, tertiary current distribution can be improved by PC as compared to DC if the pulsating diffusion layer has a constant thickness along the electrode.

关 键 词：脉冲电镀 电镀 电流分布 

分 类 号：TQ153[化学工程—电化学工业]