中间层成分对TiAl/TiB_2金属陶瓷SHS连接的影响  

Effect of composition of interlayer on TiAl/TiB_2 cermet self-propagating high-temperature synthesis joint

作　　者：李卓然[1] 曹健[1] 冯吉才[1] 谢凤春[1] 

机构地区：[1]哈尔滨工业大学现代焊接生产技术国家重点实验室,哈尔滨150001

出　　处：《焊接学报》2006年第4期29-32,共4页Transactions of The China Welding Institution

基　　金：总装备部十五预研项目(41318.5.1.2)

摘　　要：采用自蔓延高温合成(SHS)连接技术对TiB2金属陶瓷与TiAl进行连接试验,并研究工艺参数对SHS连接接头界面结构的影响。结果表明,不同成分的中间层发生SHS反应的放热量不同,从而会导致连接界面处的界面结构发生明显的变化。TiAl侧界面处出现的TiAl3反应层厚度与TiB2金属陶瓷侧出现的贫Cu层的厚度均随放热量的增加而明显增加,中间层环状结构的层数及尺寸也发生相应的变化。SHS joining of TiAl intermetallic to TiB_2 cermet was studied.The study concentrated on the effect of composition of interlayer on TiAl/TiB_2 cermet joint.It was shown that the releasing heat became different when using different interlayer.As a result,the microstructure of TiAl/ TiB_2 cermet joint changed.The TiAl_3 reaction layer in TiAl / interlayer interface and the poor-Cu layer appeared in TiB_2/interlayer interface became wider with the increase of reaction releasing heat.The loop structure in interlayer changed correspondingly.

关 键 词：自蔓延高温合成(SHS) TiB2金属陶瓷 TIAL 中间层成分 界面结构 

分 类 号：TG454[金属学及工艺—焊接]