调制光热法低温接触界面层热阻研究  

Study of thermal contact resistance by modulation photothermal method

作　　者：石零[1] 王惠龄[1] 赵琰[1] 

机构地区：[1]华中科技大学制冷与低温工程研究所

出　　处：《低温工程》2006年第2期7-9,14,共4页Cryogenics

基　　金：国家自然科学基金(51076013);教育部博士学科专项基金(20040487039)资助

摘　　要：选择航天器和低温工程中常用金属材料铜、不锈钢,用激光光热法原理,研究低温接触界面层热阻。实验得到了铜在常温下的调制频率与相位差间的实验数据,通过对实验数据的线性拟合得到了铜的热扩散系数,以及铜-不锈钢在300 K和20 K低温下的接触界面层热阻。实验表明调制光热法能够测量具有微结构特征的接触界面层热阻,且具有非接触测量的特点。The thermal contact resistance between copper and stainless steel was investigated at 300 K and 20 K using the photothermal method. The experimental data of copper was obtained about the phase lag dependence of modulation frequency at normal temperature, and the thermal diffusivity of copper was acquired by using the linear fit. The experiment results show that the interface layer thermal contact resistance can be measured by using photothemal technique and this method demonstrated some merits of non-contact measurement and short time consuming.

关 键 词：界面层热阻 光热测量 热传递 低温 

分 类 号：O514.2[理学—低温物理] TG115[理学—物理]