直接冷却中氮化铝与无氧铜低温真空接触热导的实验研究  

Thermal contact conductance of ceramic AlN and OFHC interfaces under low temperature and vacuum for HTS cryocooler cooling

作　　者：王建[1] 王惠龄[1] 陈进[1] 庄汉锐[2] 

机构地区：[1]华中科技大学能源与动力工程学院,武汉430074 [2]中国科学院上海硅酸盐研究所,上海200050

出　　处：《低温工程》2006年第2期30-34,共5页Cryogenics

基　　金：国家自然科学基金(51076013)资助项目

摘　　要：以5W／20K小型G-M制冷机为冷源，对低温下氮化铝（AlN）与无氧铜（OFHC）界面的接触热导进行了实验研究和分析。在45～140K内，氮化铝／无氧铜界面接触热导随温度的升高而增大，同时亦随接触压力的增加而增大。实验中同时得到了氮化铝在低温下的热导率，随温度的升高，氮化铝热导率值逐渐增大。就氮化铝低温热导率及氮化铝／无氧铜接触界面热阻随温度变化规律进行了微结构机理分析。The thermal conductivity of ceramic AlN and the thermal contact conductance （TCC）between AlN and OFHC under the low temperature（45 -140 K）and the vacuum（ 10^-3 -10^-4 Pa）had been measured using the axial steady heat flow method on the G-M cryocooler with 5 W/20 K capacity. Investigation shows that the TCC of AlN/Cu interface increases as the contact temperature and pressure increase, and the conductivity of ceramic AlN increases as the temperature rises. An analysis based on micro and nano structural cryogenic concept was made for explaining the change of thermal conductivity of AlN and the thermal contact conductance of AlN/Cu interface.

关 键 词：低温界面热导 声子导热 高温超导应用 制冷机直接冷却 实验研究 

分 类 号：O514.2[理学—低温物理] TG132[理学—物理]