印制线路板中化学镀锡研究现状与发展  

Current study status and development of electroless tin plating for PCB

作　　者：孙武[1] 李宁[1] 赵杰[1] 

机构地区：[1]哈尔滨工业大学应用化学系,黑龙江哈尔滨150001

出　　处：《电镀与涂饰》2006年第5期47-50,共4页Electroplating & Finishing

摘　　要：综述了PC B化学镀锡的发展现状及历史。介绍了现阶段化学镀锡工艺的优点及硫酸盐体系与烷基磺酸盐体系2种化学镀锡液的组成。分别介绍了主盐、硫脲、络合剂、还原剂及其它添加剂的作用。对化学镀锡的机理做了探讨。提出了比较合理的改进化学镀锡液的方案,尤其是在提高镀速和改善镀厚性等方面。同时提出了防止镀锡层表面变色和锡须生成的一些有效方法。The current development status and history of electroless tin plating for PCB were overviewed. The advantages of electroless tin plating process at the present stage and the composition of two kinds of electroless plating bath of sulfate system and alkyl sulfate system were introduced. The functions of main salt, thiourea, complexing agent, reducer and other additives were described respectively. The mechanism of electroless tin plating was discussed. Some rational schemes were suggested for improving electroless tin plating bath, especially in the aspects of increasing deposition rate and deposit thickness. Meanwhile some effective ways to avoid tin deposit tarnishing and tin whisker formation were proposed.

关 键 词：印制电路板(PCB) 化学镀锡 硫酸盐 烷基磺酸盐 变色 锡须 

分 类 号：TG178[金属学及工艺—金属表面处理]