应力强度因子的光弹性测试研究  

Experimental Study of Stress Intensity Fractor by Photoelastic Method

作　　者：马崇山[1] 裴希贤 

机构地区：[1]太原重型机械学院基础部

出　　处：《太原重型机械学院学报》1996年第3期214-219,共6页Journal of Taiyuan Heavy Machinery Institute

摘　　要：本文采用紧凑拉伸剪切试样作了光弹性测定．既测试了Ⅰ型袭裂纹及复合型裂纹的应力强度因子，又得到了一般加载很难实现的纯Ⅱ型裂纹．In this article,the photoelasticity is tested by using compact tension shear specimen.Both the stress intensity factors of the mode I crack and the mixed mode crack are determined in the test.And the pure mode Ⅱ crack which is difficult to appear in common loading is also determined.The determinations in this article have a proper reference value to research fracture tests.

关 键 词：应力强度因子 光弹性 紧凑拉伸剪切 

分 类 号：O348.1[理学—固体力学]