三价铬电解液镀铬沉积速度的影响因素研究  

Research of Influence Factors for the Deposition Velocity of Trivalent Chromium Electroplating

作　　者：李艳[1] 

机构地区：[1]桂林工学院材料与化学工程系,广西桂林541004

出　　处：《电镀与精饰》2006年第3期44-46,共3页Plating & Finishing

摘　　要：对三价铬电解液镀铬的沉积速度进行了实验研究。对施镀过程中沉积速度的影响因素电镀时间、电流密度、温度做了详细的实验测试,实验结果表明,为了获得较高的沉积速度,施镀过程中应该控制电镀时间为2 m in,电流密度为6 A/dm2,温度为45℃,pH为3.5。The chromium deposition velocity of trivalent chromium electroplating was researched. The factors, such as electroplating time, current density, temperature, pH value, were tested. Results show that in order to increase chromium deposition velocity, the processing parameters should he controlled as that the electroplating time is 2 min, current density is 6 A/dm^2, temper- ature is 45 ℃, pH value is 3.5.

关 键 词：三价铬电镀 三价铬 沉积速度 

分 类 号：TQ153.11[化学工程—电化学工业]