恒电位极化诱发钨铜合金化学镀镍磷的研究  

Study on Electroless Ni-P Plating on W-Cu Alloy Induced by Potentiostatic Polarization

作　　者：杨超[1] 甘复兴[1] 沈伟[2] 

机构地区：[1]武汉大学资源与环境科学学院环境工程系,湖北武汉430072 [2]武汉材料保护研究所,湖北武汉430030

出　　处：《材料保护》2006年第5期4-6,共3页Materials Protection

摘　　要：使用自行研制的镀液配方,研究了在钨铜合金基体上化学镀镍磷的可行性。试验通过恒电位极化诱发法在N iSO4-H2PO2-体系中实现了钨铜合金表面的化学镀镍磷。对极化过程中基材表面的化学镀诱发机理进行了探讨,通过筛选试验确定了外加恒电位的大小和极化时间,并对镀层形貌和质量进行了检测。结果表明,镀层具有较好的结合力和耐蚀性。因此在钨铜合金上进行化学镀镍磷时,恒电位极化法是一种较好的诱发方法。The process of electroless Ni-P plating on W-Cu alloy in NiSO_4-H_2PO^-_2system induced by potentiostatic polarization was studied.The desired polarized potential and duration were determined based on screening test.Moreover,the morphology and surface quality of the target Ni-P alloy coating were analyzed as well.It was found that potentiostatic polarization could be readily used to facilitate the electroless plating of Ni-P on W-Cu alloy,and the target Ni-P coating had good adhesion to the substrate and good corrosion resistance as well.

关 键 词：钨铜合金 化学镀镍磷 恒电位极化 外观形貌 耐蚀性 

分 类 号：TQ153[化学工程—电化学工业]