漆酚甲醛缩聚物无铬化学镀铜  

Technology for Chromium-Free Electroless Copper Plating on Urushiol Formaldehyde Condensation Polymer and Thermal Resistance of the Copper Coating

作　　者：陈钦慧[1] 陈玉[1] 林金火[1] 

机构地区：[1]福建师范大学化学与材料学院,福建福州350007

出　　处：《材料保护》2006年第5期18-22,共5页Materials Protection

基　　金：国家自然科学基金(A50473063);福建省自然科学基金(E0110022)

摘　　要：通过改变施镀工艺的pH值、温度、时间以及镀液配方中主盐浓度、还原剂浓度,得到不同条件下的化学镀层厚度、外观和镀速等试验结果,对漆酚甲醛缩聚物(PUF)基材上的化学镀铜工艺进行了研究;并用扫描电镜(SEM)、动态机械热性能(DMTA)、差示扫描量热分析(DSC)和热重分析(TG)等方法研究了镀层的形态与性能。本工艺可在PUF表面镀上一层均匀、色泽光亮的金属铜膜,其粒径匀称、排布规整、镀层致密;金属化聚合物的耐热性显著提高。Electroless copper coating was prepared on the surface of urushiol formaldehyde condensation polymer(PUF).The effects of the pH value,temperature,and concentration of the primary salt and reductant of the plating bath,and the plating duration on the deposition rate and the appearance and thickness of the Cu coating were studied.The morphology of the electroless Cu coating was observed using a scanning electron microscope,while the thermal resistance of the coating was examined by means of dynamic thermal analysis,differential scanning calorimetry,and thermogravimetry.As the results,it was feasible to prepare compact,uniform,and bright Cu coating on the PUF substrate using the developed electroless copper plating process.The resultant Cu coating was composed of evenly distributed particulates of a narrow grit size range and had good thermal resistance.

关 键 词：漆酚甲醛缩聚物 化学镀 铜镀层 耐热性能 

分 类 号：TQ153.1[化学工程—电化学工业]