焦磷酸盐镀铜锡合金稳定性的研究  

Stability of Pyrophosphate Bath for Electroplating of Cu-Sn Alloy Coating

作　　者：冯绍彬[1] 刘清[1] 包祥[1] 

机构地区：[1]郑州轻工业学院材料与化学工程学院,河南郑州450002

出　　处：《材料保护》2006年第5期23-25,共3页Materials Protection

基　　金：国家自然科学基金资助(20576126)

摘　　要：为了解决焦磷酸盐镀铜锡合金镀液的稳定性问题,对KNO3在镀液中的作用机理进了探讨。测试得到阳极和阴极的电流效率分别为100%和50%左右,阳极溶解的铜离子含量不断上升,通过循环伏安测试发现KNO3在阴极的还原造成还原产物的积累,镀液成分逐渐偏离正常工作范围,最终使工艺无法正常运转。用自制活性钛基阳极电解处理镀液,可以保证电镀的正常进行。Cyclic voltammetry was used to investigate the action mechanism of KNO_3 in the electroplating of Cu-Sn alloy coating from a pyrophosphate bath,which was aiming at increasing the stability of the plating bath.The results showed that the current efficiency of the anode and cathode was about 100% and 50%,respectively.The content of the copper ions dissolved from the anode increased continually during the plating process,while the accumulation of the deoxidized products by way of the deoxidizing of KNO_3 on the cathode led to remarkable variation in the bath composition and finally made it impossible for the electroplating to continue.Fortunately,it was feasible to restore the plating capacity of the used bath by being electrolyzed using a specifically designed active titanium-based anode.

关 键 词：铜锡合金镀层 焦磷酸盐 稳定性 

分 类 号：TQ153[化学工程—电化学工业]