化学镀Ni-W-B非晶质电阻膜的研究  

STUDIES ON ELECTROLESS PLATING OF Ni-W-B AMORPHOUS ELECTRICAL RESISTANCE FILM

作　　者：郭忠诚[1] 杨显万[1] 刘鸿康[1] 王志英[1] 王敏[1] 

机构地区：[1]昆明理工大学冶金系,昆明650093

出　　处：《化工冶金》1996年第3期220-223,共4页

摘　　要：研究了化学懂Ni-W－B合金的工艺及性能．结果表明，在Ni-B槽液中加入一定量的钨酸钠溶液，不仅能得到含钨、硼的镀层，而且还能提高镀液的沉积速度；Ni-W-B合金层在镀态时为非晶态结构，它的电阻率随钨含量的增加而增大，随镀层厚度的增加而降低．The technological properties of electroless plating of Ni-W-B alloy are pre-sented. The results show that not only deposits containing W and B are obtained, but also the deposition rate in the bath is increased, when certain amount of sodium tungstate is added into the Ni-W-B bath. Ni-W-B alloy is amorphously plated and its resistivity increases with the increase of W content, but decreases gradually with the increase of deposit thickness.

关 键 词：化学镀 非晶质 电阻膜 镍合金 

分 类 号：TG146.15[一般工业技术—材料科学与工程] TG174.4[金属学及工艺—金属材料]