铜合金化学抛光技术的研究  

Study on Chemical Polishing for Copper Alloy

作　　者：颜宝锋[1] 上官小红[1] 

机构地区：[1]中国兵器工业第213研究所,陕西西安710061

出　　处：《表面技术》2006年第3期57-58,66,共3页Surface Technology

摘　　要：为了提高铜合金表面的整平性及抗变色能力,研究了铜合金化学抛光液的组分、含量,并对各成分的作用及影响进行了讨论,通过试验分析了工艺条件对抛光质量的影响,确定了铜合金化学抛光的工艺流程及最佳工艺参数。结果表明:该工艺配方简单,操作方便,抛光作用时间短,表面整平性好,耐蚀性和抗污染能力强。In order to improve the surface flat of the copper alloy and the discoloration resistance, the composition and content of the chemical polishing solution for copper alloy are studied. The function and influences of all compositions are discussed. By means of experiment, the effects of technique on the polishing quality are analyzed and the technological flow and the optimum technological parameter are confirmed. The experiment result indicates that the technique is simple, operation is convenient, surface flat is good, the corrosion resistance and antipollution are strong.

关 键 词：铜合金 化学抛光 整平性 耐蚀性 

分 类 号：TG175[金属学及工艺—金属表面处理]