镀层厚度的X射线衍射法测量  

Measurement of Plating Thickness by X-ray Diffraction Method

作　　者：李志海[1] 周上祺[1] 任勤[1] 石泉[1] 邱绍宇[2] 李聪[2] 

机构地区：[1]重庆大学材料科学与工程学院,400030 [2]中国核动力研究设计院核燃料及材料国家级重点实验室,成都610041

出　　处：《核动力工程》2006年第3期43-46,共4页Nuclear Power Engineering

基　　金：中国核动力研究设计院核燃料及材料国家级重点实验室资助(2004-08)

摘　　要：用基体X射线衍射法测量了化学镀Ni-P合金的镀层厚度,并进行了误差分析。结果表明,基体X射线衍射法是一种精确度较高的镀层厚度无损测量法,在其适用的范围之内,能客观准确地测量出镀层厚度,误差小于金相法测量误差;基体X射线衍射法的测量结果,几乎不受基体表面镀层结晶状态的影响,可以用来测量晶态或非晶态镀层厚度。Thickness of electroless Ni-P alloy plating has been measured by the substrate X-ray diffraction method and measurement error was analyzed. It shows that the method is one non-destructive method to measure the plating thickness with high precision, and its measurement error is less than that of metallographic method within its measurement range. This method can used to measure the crystal and noncrystal plating because it is hardly effected by the crystal state of plating.

关 键 词：镀层厚度 X射线衍射 无损测量 化学镀 

分 类 号：TG115.22[金属学及工艺—物理冶金]