Ni-W-SiC纳米复合电镀工艺的研究  

Study on Ni-W-SiC Nanometer Electrodeposition Process

作　　者：王晋春[1] 程旭东[1] 李丹虹[1] 杨章富[1] 欧阳贵[2] 

机构地区：[1]武汉理工大学材料复合新技术国家重点实验室,武汉430070 [2]武汉材料保护研究所,武汉430030

出　　处：《材料工程》2006年第3期25-28,共4页Journal of Materials Engineering

摘　　要：采用一种新型的分散方法促使纳米SiC在镀液中的均匀有效分布。初步探讨了工艺参数对复合镀层的影响,着重研究阴极电流密度对Ni-W-SiC纳米复合镀层表面形貌、断面形貌、n-SiC共析量和显微硬度的影响。结果表明:在其他工艺不变的条件下,选择适当的电流密度可制备出形貌良好、成分均匀、硬度较高的纳米复合镀层。A new disperse method was applied to disperse n-SiC to avoid conglomerating. The effect of process parameters on the nano-composite coating was presented. The influence of cathodic current density on surface morphology, section morphology, n-SiC co-deposition amount and microhardness of nano-composite coating was mainly studied. The result shows that good morphology, n- SiC particle dispersed uniformly and highly microhardness value of nano-composite coatings can be prepared under proper current density when other process conditions are same.

关 键 词：纳米复合电镀 共析量 表面形貌 显微硬度 

分 类 号：TQ153[化学工程—电化学工业]