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作 者:赵琰[1] 王惠龄[1] 谢江波[1] 吴钢[1] 石零[1]
机构地区:[1]华中科技大学制冷与低温工程研究所,武汉430074
出 处:《低温与超导》2006年第3期205-209,共5页Cryogenics and Superconductivity
基 金:国家863高技术研究发展计划(2002AA306331-4);教育部博士学科点专项科研基金(20040487039)资助
摘 要:对一种新型的超导低温系统电流引线(Peltier引线)进行了分析;建立了考虑热界面效应的数学模型,给出了可用于迭代求解的解析表达式;以最小漏热和最小功耗两种目标分别对直接冷却下的Peltier引线进行了结构优化,分析了热电材料与铜之间的接触界面热阻、电阻的影响。不考虑界面阻力时,优化得到的PCL引线与二元电流引线相比,漏热可减少近30%,功耗可减少约26%。界面阻力会明显削弱PCL引线的优势,需在设计中给与足够重视,依据工作电流将界面阻力控制在可以接受的范围。A new type of current lead called Peltier Current Lead(PCL) is modeled and analyzed quantitively considering interface resistance under both minimum heat leak and work consumption criteria. Taking the advantages of TE modal's low thermal conductivity and thermal - electric conversion ability, when it's added at the room temperature end of conventional binary current leads, heat leak though current leads is reduced significantly. A 30% reduction is obtained when no interface effect is considered. It is still attractive when interface resistance is taken into account, as long as well controlled. A parameter H is extracted to describe the interface effect, both thermally and electrically.
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