氨水溶液解吸强碱性树脂上负载铜的研究  

Elution of Copper from Alkali Resin Using Ammonia Solution

作　　者：宋永辉[1] 兰新哲[1] 张秋利[1] 李秀玲[1] 

机构地区：[1]西安建筑科技大学

出　　处：《金属矿山》2006年第6期83-86,共4页Metal Mine

基　　金：国家863计划项目(编号:2003AA32X090);陕西省自然科学基金项目(编号:2000C08)

摘　　要：研究了用氨水溶液从强碱性树脂上解吸铜的工艺。通过温度、时间、解吸液浓度及用量等因素与铜解吸率之间关系的实验,确定了最佳解吸条件:时间为90 m in、常温、氨水体积浓度为8%、解吸剂与树脂的体积比为10∶1,此时铜的解吸率可达90%以上。同时实验表明,氨水解吸铜符合Body液膜扩散方程,过程以液膜扩散为主要控制步骤,解吸的速率常数k=5.73×10-4s-1。解吸表观活化能为11.21 kJ/mol,表明反应速率对温度不敏感。The elution process of copper-loaded alkali resin using ammonia solution was studied. Through the experimental study on the relationship of the copper elution rate with the elution temperature, the time and the concentration and consumption of elutant, the optimal elution conditions were determined, Under the conditions of an elution time of 90 min, normal temperature, volumetric concentration of ammonia solution of 8% and volumetric ratio of eluting agent to resin of 10： 1, the copper elution rate can be over 90%. The test shows that the elution of copper using ammonia solution conforms to Body liquid film diffusion equation and the process is mainly controlled by the liquid film diffusion. The elution rate constant k is 5.73 × 10^-4 s^-1 and the apparent activation energy, 11.21 kJ/mol, indicating that the reaction rate is not sensitive to temperature.

关 键 词：氨水 解吸 负载树脂 铜 

分 类 号：TQ425.23[化学工程] TQ226.3