IC引线框架材料概述  

Summarization on the Materials for IC Lead Frame

作　　者：刘凯[1] 齐亮[1] 谢春晓[1] 

机构地区：[1]江西理工大学,江西赣州341000

出　　处：《热处理》2006年第2期21-24,共4页Heat Treatment

摘　　要：评述了国内外引线框架材料研究开发的现状,指出了国内引线框架用铜带与国外产品相比存在的差距,分析了今后引线框架铜带的需求和发展方向,并介绍了几种典型的合金及其特性。The current status of development of the lead frame materials at home and abroad was summarized. The gap between Chinese-made strips and foreign copper ones for the lead frame was pointed out. The requirements for copper strips for the lead frame and its development were analyzed. Moreover,several kinds of typical alloys and their characteristics were introduced.

关 键 词：引线框架材料 铜基合金 CU-FE-P合金 CU-CR-ZR合金 

分 类 号：TG146.11[一般工业技术—材料科学与工程]