苯炔基封端的联苯型聚酰亚胺复合材料  

Biphenyl polyimide composite endcapped with phenylethynyl

作　　者：王震[1] 杨慧丽[1] 益小苏[2] 丁孟贤[1] 

机构地区：[1]中科院长春应用化学研究所高分子物理与化学国家重点实验室,长春130022 [2]北京航空材料研究院先进复合材料国防科技重点实验室,北京100095

出　　处：《复合材料学报》2006年第3期1-4,共4页Acta Materiae Compositae Sinica

基　　金：国家自然科学基金项目(50033030);航空科技联合基金项目(10577018);国家973项目资助(G2003CB615604)

摘　　要：采用改性单体原位反应聚合法(MPMR)制备了苯炔基封端的聚酰亚胺树脂,采用模压方法研究了聚酰亚胺复合材料的成型工艺。所制备的树脂和复合材料均具有很高的热稳定性;复合材料在371℃的力学性能保持率高于室温力学性能的50%;其玻璃化转变温度为449℃;纯树脂和复合材料在371℃空气中100 h的热失重小于3%。所研制的聚酰亚胺复合材料基本满足了371℃高温树脂的性能。High temperature biphenyl polyimide resin endcapped with phenylethynyl was prepared using the modified polymerization monomeric reactants method （MPMR）. The polyimide composite was fabricated by press molding, and the processing technique was discussed also. The polyimide composite shows high thermal stability at 371℃. The mechanical properties of the composite at 371℃ can maintain as much as 50% of mechanical properties at room temperature. The glass transition temperature of the polyimide composite is 449℃. The mass loss at 371℃ in air is less than 3% over 100 h at 371℃. The obtained polyimide composite achieves the basic demands of the high temperature resin at 371℃.

关 键 词：聚酰亚胺 复合材料 苯乙炔 热性能 力学性能 

分 类 号：TB332[一般工业技术—材料科学与工程]