基于SU-8负胶的微流体器件的制作及研究  

Fabrication and study of microfluidic devices using SU-8

作　　者：王彬[1] 陈翔[1] 许宝建[1] 金庆辉[1] 赵建龙[1] 徐元森[1] 

机构地区：[1]中国科学院上海微系统与信息技术研究所,上海200050

出　　处：《功能材料与器件学报》2006年第3期215-219,共5页Journal of Functional Materials and Devices

基　　金：上海市AM基金(批准号:AM0303);上海市纳米专项基金(No.0452NM038)

摘　　要：采用SU-8结构释放并键合玻片制作了多层结构的微流体芯片,探讨了影响芯片气密性和沟道堵塞的因素,并通过荧光显示验证,提供了一种快速、低成本的塑性微流体器件制作方法。Based on SU -8 structural releasing and bonding with glass substrate, microfluidic chips with multilayered structure were fabricated. Various factors concerning the gas tightness and blocking of the channels were studied. Based on on - chip fluorescent illustration as on - line test, a rapid fabrication method of plastic microfluidic devices at low cost is presented.

关 键 词：微流体器件 结构释放 SU-8键合 塑性 

分 类 号：TN305.7[电子电信—物理电子学]