微光增强型电荷耦合装置成像系统三维噪声模型及其测量分析  

3-D Noise Measurement and Analysis for a Low-light-level ICCD Imaging System

作　　者：李升才[1] 徐宗昌[2] 肖顺旺[1] 

机构地区：[1]北京特种车辆研究所,北京100072 [2]装甲兵工程学院,北京100072

出　　处：《兵工学报》2006年第3期463-466,共4页Acta Armamentarii

摘　　要：为了方便地计算三维噪声,提出了一种新的三维噪声计算方法,该方法对离散型微光成像系统三维噪声测量和质量评价具有十分重要的实用价值。利用微光成像系统三维噪声测量系统,结合数字图像处理技术,测量了微光增强型电荷耦合装置(ICCD)成像系统在四种照度条件下的三维噪声,并对结果进行了分析。分析结果与微光ICCD成像系统实际性能相吻合。A new method was advanced for calculating 3-D noise expediently. The method has the practical merit for 3-D noise measurement and quality evaluation of discrete low-light-level imaging system. The 3-D noise of ICCD （Intensifier Charge Coupled Device） imaging system is measured and analyzed with the help of digital image processing technology and measurement system. The result of measurement and analysis accords well with the performance of a low-light-level ICCD imaging system.

关 键 词：电子技术 夜视技术 三维噪声 空间噪声 时间噪声 信噪比 微光成像系统 

分 类 号：TN2[电子电信—物理电子学]