SiC晶须/颗粒增韧金属陶瓷切削刀具的研究  

SiC Whisker/Particle Toughened Cermet For Cutting Tool

作　　者：丁燕鸿[1] 杨杨[1] 

机构地区：[1]中南大学材料科学与工程学院

出　　处：《株洲工学院学报》2006年第4期60-62,共3页Journal of Zhuzhou Institute of Technology

摘　　要：在TN30金属陶瓷切削刀片中添加SiC晶须/颗粒,采用真空烧结法制备出新型TN30W金属陶瓷复合材料刀具。研究烧结温度对TN30W刀具力学性能的影响,探讨SiC晶须/颗粒的增韧机理。结果表明:TN30W切削刀具在1 450℃烧结时,能获得最佳的综合力学性能,特别是抗弯强度和断裂韧性得到明显提高。The new TN30W cutting tools of cermet composites were fabricated with the vacuum sintering technique while the SiCw/SiCp are added to the TN30 cutting tools. The effects of sintefing temperatures on the mechanical properties of the TN30W tools were studied, and the toughening mechanisms of the SiCw/SiCp are discussed. The results show that the optimal comprehensive mechanical properties of the TN30W cutting tools can be obtained with the sintefing technique at 1 450 ℃, especially,their flexural strength and fracture toughness are improved markedly. The toughening mechanisms of the TN30W tools include ductile phase toughening, crack bridging, crack deflection and pullout effect.

关 键 词：金属陶瓷 SiC晶须/颗粒 力学性能 增韧机制 

分 类 号：TB333[一般工业技术—材料科学与工程]