FPGA和ASIC设计特点及应用探讨  

Discussion on the Design Characteristics and Applications of ASIC and FPGA

作　　者：孟李林[1] 

机构地区：[1]西安邮电学院,西安710061

出　　处：《半导体技术》2006年第7期526-529,共4页Semiconductor Technology

基　　金：国家"十五"科技攻关课题(2002BA106B06);国家863计划课题(2003AA1Z1190)

摘　　要：介绍了ASIC、FPGA的设计步骤和设计流程,重点比较两者之间的设计特点和应用趋向,采用这两种不同方法完成40G高阶数字交叉连接芯片设计。通过比较表明:FPGA技术适用于小批量、产品更新快、周期短的电子产品设计,可以明显提高设计速度,缩短产品上市时间;ASIC技术适用于大批量、产品比较成熟、生命周期长的电子产品设计。ASIC的集成度和单片价格都比FPGA有优势。The design flow of FPFA and ASIC and comparisons were focused on, including their features and their application trends. A space division cross connect chip for 40G higher order cross connect system was implemented in both design methods, FPGA can shorten time-tomarket of electronics products with low design cost, so it is preferable to small lot electronics products with fast updating and short life cycle. Whereas ASIC is higher integrations and lower price of per chip than that of FPGA, it suits for mature batch-bulk electronics products.

关 键 词：现场可编程器件 专用集成电路 系统集成 

分 类 号：TN47[电子电信—微电子学与固体电子学]