环保型电子封装用Sip/Al复合材料性能研究  

Study on properties of the environmental-friendly Sip/Al composites for electronic packaging applications

作　　者：武高辉[1] 修子扬[1] 孙东立[1] 张强[1] 宋美慧[1] 

机构地区：[1]哈尔滨工业大学材料科学与工程学院,黑龙江哈尔滨150001

出　　处：《材料科学与工艺》2006年第3期244-246,250,共4页Materials Science and Technology

基　　金：国家高技术研究发展计划资助项目(2003AA305110);2005年哈尔滨市科技攻关计划项目(2005AA5CG041)

摘　　要：为研究电子封装用Sip／Al复合材料热物理及力学性能，利用挤压铸造方法制备了体积分数为65％的Sip／LDll（A1—12％Si）可回收环保型复合材料．采用TEM观察、膨胀仪、激光导热综合测试仪以及万能电子拉伸试验机等设备及技术对复合材料进行研究．结果表明：Sip／LDll复合材料组织致密，材料中未观察到孔洞和缺陷；20～50℃时复合材料的热膨胀系数为8．1X10^-6／℃，并随着温度的升高而增加，退火处理能够降低复合材料的热膨胀系数；Sip／LDll复合材料铸造状态和热处理状态的热导率分别为132．9、160．1w／m·℃，复合材料的弯曲强度和比模量较高；可以采用化学镀方法在复合材料表面涂覆M层，镀层结合强度良好，是一种优异的电子封装用复合材料．A reclaimed environmental-friendly Sip/LDll （A1- 12% Si） composite with volume fraction of 65% was fabricated by squeeze casting technology. The thermo-physical and mechanical properties of Sip/A1 composite for electronic packaging application were studied by use of TEM observation, thermal expansion analyzer, laser thermal conduction analyzer and tensile test machine. The results show that the composite was free of porosity and the Si particles distributed uniformly. The coefficient thermal expansion of composite reached 8.1 x 10-6/℃ from 20 ℃ to 50 ℃ and increased with the temperature, also reduced after annealing. The thermal conductivity of casting and annealing treatment were 132.9 W/m - ℃ and 160.1 W/m ℃, respectively. The flexural strength and specific modulus were moderately high. An electroless nickel surface was established on the composite. It is an excellent composite for electronic packaging application.

关 键 词：SI 铝基复合材料 热导率 热膨胀 电子封装 

分 类 号：TB331[一般工业技术—材料科学与工程]