弥散强化铜合金中弥散相的观察及析出过程  

Microstructure and Precipitation Process of Dispersoids of Dispersion-strengthened Copper Alloy

作　　者：陆艳杰[1] 崔舜[1] 康志君[1] 周文洪[2] 

机构地区：[1]北京有色金属研究总院粉末冶金及特种材料研究所,北京100088 [2]西南油气田重庆气矿,重庆638500

出　　处：《材料导报》2006年第F05期219-221,共3页Materials Reports

摘　　要：用透射电镜(TEM)、高分辨电镜(HRTEM)观察了Al2O3弥散强化铜合金的微观结构,并分析了影响弥散相大小及分布的因素。用X射线衍射仪精确测定了Cu基体的衍射峰位置,依据衍射峰的位置变化探讨了Al脱溶及Al2O3质点的析出过程。结果表明:用内氧化法制备弥散强化铜合金时,Al2O3质点在内氧化阶段析出,且Al充分脱溶,内氧化反应进行得很彻底;合金在烧结和热挤压阶段都没有质点析出。合金中Al2O3质点均匀弥散地分布在晶界和晶粒内,并且晶粒内质点比晶界质点更细小、弥散,大小约5nm,间距10nm,晶界处的质点大小约10nm,间距约50nm。The rnicrostructure of alumina dispersion-strengthened copper alloy are investigated using transmission electron microscopy（TEM） and high-resolution transmission electron microscopy（HRTEM）,and the effect factors on the dispersoids are analyzed as well. The precipitation process of alumina is discussed according to the position of diffraction peak of Cu which is determined by X-ray diffraction. The results show that alumina completely precipitates during the stage of internal oxidation and no Al2O3 precipitates during sintering or heat extruding. In the alloy,alumina uniformly distribute inside the copper grains and at the grain boundaries. The mean size and distance between the alumina locating inside the grains are about 5nm and 10nm which are smaller than ones distributing at the boundaries at which the mean size and distance are about 10nm and 50nm.

关 键 词：弥散强化 铜合金 微观结构 内氧化 

分 类 号：TG146.11[一般工业技术—材料科学与工程] TG146.21[金属学及工艺—金属材料]