固体电解质(玻璃)与硅的阳极连接机理及界面分析  

Interfacial Structure and Joining Mechanism of Anodic Bonding

作　　者：胡利方[1] 秦会峰[1] 宋永刚[1] 孟庆森[1] 

机构地区：[1]太原理工大学材料科学与工程学院,太原030024

出　　处：《材料导报》2006年第F05期356-358,共3页Materials Reports

基　　金：国家自然科学基金资助项目(编号:50375015);山西自然基金资助项目(编号:20031051)

摘　　要：固体电解质(玻璃)与硅片通过阳极连接可以实现良好键合。采用SEM和EDS对界面结构进行了分析。连接的过程与由耗尽层产生的静电场力有紧密关系,通过建立的模型分析了电场力产生的原因。实验表明:温度、压力、连接时间、表面光洁度、电压是影响连接质量的重要因素,优化连接参数是形成良好连接界面的前提。Anodic bonding applied in the joining of solid electrolyte borosilicate glass and silicon is achieved with bonding machine in the assistance of static electric field. SEM and EDS are applied to investigate and analyze the microstructure of the interface. The process relies heavily on the electrostatic force produced by the depletion region, and a model is built to analyze the dominant factor of the electrostatic force. Temperature, pressure, time, the roughness of the surface and voltage are also the basic factors of the anodic bonding. So optimizing parameters is very important in the bonding process.

关 键 词：Pyrex玻璃 硅 阳极连接 静电场力 

分 类 号：TG456.9[金属学及工艺—焊接] TM911.4[电气工程—电力电子与电力传动]