脉冲强激光破坏Hg_(0.8)Cd_(0.2)Te晶片材料的机理分析  

Destruction mechanism of Hg_(0.8)Cd_(0.2)Te induced by high power pulsed TEA-CO_2 laser

作　　者：蔡虎[1] 程祖海[1] 朱海红[1] 左都罗[1] 

机构地区：[1]华中科技大学激光技术国家重点实验室,武汉430074

出　　处：《强激光与粒子束》2006年第6期927-930,共4页High Power Laser and Particle Beams

基　　金：国家973计划项目资助课题

摘　　要：利用光学金相显微镜对TEA-CO2脉冲强激光辐照的Hg0.8Cd0.2Te晶片表面进行了观察。在单脉冲能量为37.5 J,能量密度为937.5 J/cm2的强激光辐照下,晶片表面呈现出熔融迹象和大量的微裂纹,微裂纹密度从激光辐照区中心向外逐渐减少,裂纹沿晶体的(111)面扩展。随着脉冲连续作用次数的增加,晶片表面熔融更加剧烈,裂纹数目、裂纹深度和宽度都有所增加。分析认为:HgCdTe晶片的破坏与激光辐照能量、脉冲连续作用次数、激光场强分布、激光热应力、激光支持的燃烧波和物质的蒸发波等冲击波有关。The surfaces of HgCdTe plates irradiated by one pulse of TEA-CO2 laser with 37.5 J and energy density of 937.5 J/cm^2 are examined by an optical microscope. After laser irradiation, there are large numbers of cracks and much trace of melting in the surface of the plate, and the cracks extending in （111） are the densest in laser irradiation zone. With the increase of the action number of laser pulses at repetition rate of 1 Hz, the melting is more serious, and the numbers, depth and breadth of cracks are all increased. Analyses show the destruction of HgCdTe plates is related with laser energy, action number of laser pulses at repetition rate of 1 Hz, laser field intensity, thermal stress, laser supported combustion wave and evaporation wave.

关 键 词：TEA-CO2脉冲激光 HGCDTE 裂纹 破坏机理 

分 类 号：TN249[电子电信—物理电子学]