选择性螯合滴定法测定电镀液和镀层中铜的含量  

Selective Chelatometric Determination of Cu in Plating Solution and Deposit

作　　者：王献科[1] 李玉萍[1] 

机构地区：[1]兰州市东岗镇钢厂

出　　处：《电镀与涂饰》1996年第3期9-12,共4页Electroplating & Finishing

基　　金：甘肃省自然科学基金

摘　　要：本法先用ＥＤＴＡ螯合Ｃｕ２＋和其他金属阳离子，然后加入ＤＬ－半胱氨酸作为释放剂分解Ｃｕ－ＥＤＴＡ，释放出的ＥＤＴＡ用Ｐｂ２＋标准溶液返滴定，以ＸＯ－ＭＴＢ－ＣＰＢ为混合指示剂，滴定终点颜色变化敏锐，测定结果准确。并对多种金属离子的干扰进行了研究。The determination process is based on initial chelation of Cu2+ and other metal ions with EDTA and subsequent decomposition of Cu-EDTA with DL-cysteine as liberate agent. The liberated EDTA is titrated with Pb2+ standard solution using XO-MTB-CPB as alexed indicator. Titration end point is sensitive and determination result is accurate. Interference of various metal ions is also studied.

关 键 词：化学分析 螯合滴定 铜 电镀 镀液 镀层 

分 类 号：TQ153[化学工程—电化学工业]