中空纤维镍基板电化学浸渍动力学分析  

Kinetics of Electrochemical Impregnation Process of Hollow Fibrous Nickel Plaque

作　　者：李钒[1] 王习东[1] 张梅[1] 张登君[2] 

机构地区：[1]北京科技大学物理化学系,北京100083 [2]中国科学院过程工程研究所,北京100080

出　　处：《稀有金属》2006年第3期376-379,共4页Chinese Journal of Rare Metals

基　　金：国家自然科学基金(50425415)资助项目

摘　　要：为合理控制浸渍时间和提高浸渍质量,在实验室研究的基础上,对中空纤维镍基板的电化学浸渍和特殊电化学浸渍的增重动力学进行了探讨,分析了浸渍过程机制,提出了浸渍过程动力学的三段控速机制,即化学反应-化学反应与扩散混合-扩散控速,并推导出了其数学表达式。用这三段控速的数学表达式,处理了基板增重随浸渍时间变化的实验数据。结果表明:基板浸渍增重规律与三段控速的机制相一致,且改变实验条件,如增加电流密度或浸渍前对基板进行真空预处理,只是提高了浸渍反应速率,缩短了相应的浸渍前期和中期的反应时间。To suitably control impregnation time and improve the quality of impregnation, kinetics of weight gain in impregnation process of hollow fibrous nickel plaque were investigated by electrochemical impregnation and special electrochemical impregnation. For the process and the mechanism on reaction rate controlled by three stages was chemical reaction-chemical reaction mixed with diffusion-diffusion was proposed and their mathematical expressions were derived and the experimental data of weight gain with impregnation time were treated by the expressions. From the results the regulaity of weight gain with time coincides with the mechanism on reaction controlled by three stages and changing the experiment conditions such as increasing current density only the reaction rate increases and conespondent impregnation reaction time shortens in initial and middle stages.

关 键 词：中空纤维镍基板 浸渍动力学 三段控速机制 

分 类 号：TM912.2[电气工程—电力电子与电力传动]