铝合金可焊性镀膜工艺设计  

Technique of Plating on Aluminium Alloy

作　　者：龚光福[1] 胡江华[1] 张晔[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230031

出　　处：《电子工艺技术》2006年第4期234-237,共4页Electronics Process Technology

基　　金：国防科工委十五预研课题;K1101020302焊接工程化

摘　　要：铝合金表面在大气中、水中马上生成氧化膜,氧化膜的存在严重影响镀层的结合力,成为铝合金镀膜的难点。通过铝合金镀膜原理分析和现有工艺方法的对比,认为采取二次浸锌、化学镀、电镀复合工艺技术可以克服氧化膜的影响,是较为简单的工艺路线。实验证明,采用该方法获得的镀膜层通过300℃热震试验不起皮、不鼓泡,并具有良好的低温可焊性。Because of oxidizing in the air or water immediately, and the oxidation can damage the adhesion of the coating, so it is difficult to plate on the surface of aluminium alloy. By analyzing the principle of plating and comparing the technologies in existence,think that a sample process which consists of twi - dipping in zincate, chemical plating and electroplating can overcome the effect of oxidation film. It proves by the experiment that the coating obtained by this process can meet the testing of temperature shock at 300 ℃ and possess nice performance of soldering at low temperature.

关 键 词：铝合金 镀膜工艺 镀膜原理 低温钎焊 

分 类 号：TG146.1[一般工业技术—材料科学与工程]