多组分铜基合金粉末选区激光烧结的组织形成机制  

MICROSTRUCTURE DEVELOPING MECHANISM IN SELECTIVE LASER SINTERING OF MULTI-COMPONENT Cu-BASED ALLOY POWDER

作　　者：沈以赴[1] 顾冬冬[1] 赵剑峰[2] 黄因慧[2] 杨家林[3] 王洋[3] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016 [2]南京航空航天大学机电学院,南京210016 [3]中国工程物理研究院机械制造工艺研究所,绵阳621900

出　　处：《机械工程学报》2006年第7期114-118,共5页Journal of Mechanical Engineering

基　　金：国家自然科学基金委员会-中国工程物理研究院联合基金(10276017);航空科学基金(04H52061);南京航空航天大学科研创新基金(S0403-061)资助项目。

摘　　要：对多组分铜基金属粉末(组分Cu、CuSn、CuP,质量比为55:35:10)进行了选区激光烧结试验,其中熔点较低的CuSn充当粘结金属,熔点较高的Cu充当结构金属,CuP则作为脱氧剂而改善润湿性。粉体激光烧结的主导成形机制为液相生成和颗粒重排。合理调控激光工艺参数(激光功率275～400 W,扫描速率0．03～0．06 m·s-1),以使粘结金属CuSn发生熔化,而结构金属Cu保持未熔状态。在保证粉末部分熔化的液相烧结机制的前提下,适当增加激光功率或减小扫描速率,有利于提高烧结致密度及组织均匀性。Selective laser sintering of a multi-component Cu-based metal powder with the Cu, CuSn and CuP weight ratio of 55 ： 35 ： 10 has been successfully processed. The CuSn metal powder with a lower melting point acts as the binder, while the Cu powder with a higher melting point acts as the structural metal. The CuP powder is taken as a fluxing agent to improve the wetting characteristics. The dominant sintering mechanism is liquid formation and particle rearrangement. Care should be taken to determine the suitable processing parameters （laser power of 275～400 W and scan speed of 0.03～0.06 m·s^-1） in order to ensure the melting of the binder CuSn but the non-melting of the structural metal Cu. Under condition that the mechanism of liquid phase sintering with partial melting of the powder prevails, increasing laser power or decreasing scan speed can generally improve sintering density and structural homogeneity.

关 键 词：选区激光烧结 铜基金属粉末 烧结机制 液相烧结 工艺参数 

分 类 号：TG14[一般工业技术—材料科学与工程] TG66[金属学及工艺—金属材料]