陶瓷粉化学镀钴工艺研究  

Electroless cobalt plating on ceramic powders surface

作　　者：杜光旭[1] 周晓华[1] 王旭辉[1] 涂国荣[1] 

机构地区：[1]西北核技术研究所,陕西西安710024

出　　处：《电镀与涂饰》2006年第7期10-14,共5页Electroplating & Finishing

摘　　要：根据化学镀原理,以镀后粉末的相对增重质量为主要指标,利用正交实验研究了在陶瓷粉末上进行化学镀钴。分析了钴离子浓度、酒石酸钠浓度、稳定剂浓度、温度以及pH对沉积效率的影响。测试了化学镀钴前后的微观形貌SEI图及XRD图。实验结果表明,溶液中的硫酸钴浓度、络合剂浓度、温度以及pH的增大,都会加快沉积速度。经X衍射分析表明,钴的晶体结构为体心六方结构。Taking the relative weight increment of the ceramic powders after plating as an index, the electroless cobalt plating on the ceramic powders surface was studied through orthogonai test、 The influences of cobalt ion centent, sodium tartrate centent, stabilizing agent centent, temperature and pH on deposition rate were analyzed. The SEI and XRD photos of the ceramic powders micromorphology before and after deposition were tested. Results show that the cobalt deposition rate can be accelerated by increasing pH,temperature, concentration of cobalt sulphate and complexing agent. The structure of the spherical cobalt particles on the ceramic powders was found to be hexagonal by X-ray diffraction.

关 键 词：陶瓷粉 化学镀钴 正交实验 微观形貌 SEI图 XRD图 

分 类 号：TG178[金属学及工艺—金属表面处理] TQ153[金属学及工艺—金属学]