选择性激光烧结法制备SiC颗粒预制体  

Preparation of SiC Particle Perform by Selective Laser Sintering

作　　者：邓颖[1] 余欢[1] 徐志锋[1] 蔡长春[1] 胡美忠[1] 严青松[1] 

机构地区：[1]南昌航空工业学院材料学院,江西南昌330034

出　　处：《热加工工艺》2006年第14期11-12,16,共3页Hot Working Technology

基　　金：航空基金资助项目(00H56009);江西省材料科学与工程研究中心开放基金资助项目(ZX200401011)

摘　　要：介绍了一种新的制备颗粒预制体的方法,即采用选择性激光烧结(SLS)法制备SiC颗粒预制体。结果表明,用表面已预处理的SiC与粘结剂混合粉料作为SLS用粉,在一定的激光烧结工艺条件下,可将其烧结成SiC颗粒均匀分散的预制体;并可通过控制烧结粉末的配比获得不同孔隙率的SiC颗粒预制体。A new method for preparation of SiC particle preform by selective laser sintering （SLS）was introduced. The results show that under the proper processing parameter conditions, surface pretreaunent SiC and binder mixture powders can be produced into SiC particle perform, which SiC particles are uniformly located, and different porosity ratio of perform can be obtained by controlling the ratio of mixture powders.

关 键 词：SiC颗粒预制体 选择性激光烧结 制备 

分 类 号：TF124[冶金工程—粉末冶金]