异步叠轧(AARB)铜板再结晶的研究  

Study on Recrystallization of Copper Sheets Prepared by Asymmetrical Accumulative Rolling-Bond Process

作　　者：吴承玲[1] 史庆南[1] 王军丽[1] 张坤华[1] 

机构地区：[1]昆明理工大学云南省新材料制备与加工重点实验室,云南昆明650093

出　　处：《金属热处理》2006年第7期81-83,共3页Heat Treatment of Metals

基　　金：云南省自然科学基金项目(2003E0003Z)

摘　　要：对七道次异步叠轧铜板采用220℃×30 m in和220℃×40 m in两种工艺进行退火,运用背散射电子衍射技术对两种铜板的再结晶程度、织构和晶界特征分布进行了研究。结果表明,经220℃×40 m in退火处理后,铜板的再结晶较完全,其织构为明显的{100}〈001〉立方织构;而经220℃×30 m in退火处理后,铜板内仍存在晶体缺陷,其织构为{123}〈412〉轧制织构及少量的{100}〈001〉立方织构。晶界特征分布图表明晶界都主要分布在Σ1、Σ3、Σ7、Σ9和Σ11位置上,采用220℃×40 m in退火处理后铜板中各主要晶界的含量明显高于采用220℃×30m in退火后的。The copper sheets prepared by asymmetrical accumulative rolling-bond process （AARB） with 7 passes were annealed at 220 ℃ for 30 min and 40 min respectively, the recrystallization evolution, texture and grain boundary character distribution（GBCD） of the two sheets were investigated by electron back scattering diffraction（EBSD）. The results show that the recrystallization after annealing at 220 ℃ for 40 min is finished completely,its texture is clear { 100} 〈001 〉 cubic lattice ; while after annealing at 220 ℃ for 30 min there are many defects in the copper sheets, and its texture is roll- ing texture of {123} （412）with a little {100} （001）cubic lattice. GBCD patterns indicate that most boundaries distribute on ,∑1 ,∑3 ,∑7 ,∑9 and ,∑11, the coincidence site lattice （CSL）boundary content with 220 ℃× 40 min annealing is higher than that with 220 ℃× 30 min process.

关 键 词：异步叠轧(AARB) 铜板 再结晶 背散射电子衍射技术(EBSD) 重合点阵(CSL) 

分 类 号：TG146.1[一般工业技术—材料科学与工程] TG115.21[金属学及工艺—金属材料]