化学镀锡晶须的研究进展  

Research Progress of Tin Whisker in Electroless Tin Plating

作　　者：赵杰[1] 李宁[1] 孙武[1] 付石友[2] 

机构地区：[1]哈尔滨工业大学应用化学系,黑龙江哈尔滨150001 [2]哈尔滨工业大学(威海)海洋学院,山东威海264209

出　　处：《电镀与环保》2006年第4期1-3,共3页Electroplating & Pollution Control

摘　　要：简述化学镀锡工艺中锡须的危害,详细归纳锡须产生的机理,总结影响锡须的因素,同时列举目前抑制锡须的方法,指出锡须是由于压应力的存在而产生的,铜和锡的金属共化物、热膨胀系数不匹配以及外部压力等因素对锡须的生长有很大的影响。增加合金层以及加入聚合物等方法可以有效地抑制锡须的生长。The harm of tin whisker in electroless tin plating is briefly described. The forming mechanism of tin whisker is summarized. The affecting factors of fin whisker are reviewed. Some effective measures for controlling tin whisker are also listed. It is pointed out that the existence of compressive stress is the cause for the formation of tin whisker. Intermetallic compound, mismatches in coefficient of thermal expansion and extrinsic compressive stress have a great impact on tin whisker growth. Tin whisker growth can be effectively inhibited by adding alloy layer, putting in polymer, etc.

关 键 词：化学镀锡 锡须 机理 铜锡化合物 

分 类 号：TQ153[化学工程—电化学工业]