有机中间体对电镀酸性硬铜硬度的影响  

The Influences of Additives on Hardness of Acid Hard Copper Plating

作　　者：王庆浩 谢洪波[2] 马学奎[2] 

机构地区：[1]青岛海联制版有限公司,山东青岛266100 [2]青岛大学应用技术学院,山东青岛266071

出　　处：《电镀与环保》2006年第4期14-18,共5页Electroplating & Pollution Control

摘　　要：近年来,铁基圆筒电镀厚铜替代铜辊的电镀硬铜加工量随凹印制版产量的增加而急剧增长。但与普通酸性光亮镀铜相比,国内外能供选择的商品酸性电镀硬铜光亮剂为数较少,涉及镀层硬度影响因素的研究更少。本文主要对目前国内外常见的酸性镀铜中间体、单体光亮剂对硬度的影响进行了测试研究。In recent years, plating thick copper on iron-based roll is increasingly substituted for plating hard copper on copper roll along with the increasing of gravure plate production. However, compared with common acid bright copper plating, the available additives for acid hard copper plating are rather few, and the researches related to the factors affecting hardness of the coatings are even fewer. The influences of the intermediate and monomer brighteners commonly used in present acid copper plating on the hardness of the coating are tested and studied.

关 键 词：酸性镀铜 电镀硬铜 凹印制版 酸铜中间体 

分 类 号：TQ153[化学工程—电化学工业]