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机构地区:[1]哈尔滨工业大学应用化学系,哈尔滨150001
出 处:《腐蚀科学与防护技术》2006年第4期298-301,共4页Corrosion Science and Protection Technology
摘 要:利用CHI630电化学分析测试仪研究了在浸锌溶液中加入不同稳定剂及不同含量的最优稳定剂后试片在浸锌过程中的活化电位随浸锌时间的变化曲线和浸锌后的试片在3.5%NaCl溶液中的极化曲线.结果表明,稳定剂可以提高浸锌后试片的稳定电位,提高浸锌层在3.5%NaCl溶液中的耐蚀性.稳定剂A是较适宜的浸锌溶液中的稳定剂,其适宜的用量为0.05 g/L^0.1 g/L.利用SEM、EDS对浸锌层、化学镀Ni-P层的形貌和成分进行了分析,镀层结合力合格,并初步探讨了浸锌溶液中稳定剂的作用机理.CHI 630 electrochemical tester was applied to analyze E-t curves of zinc platings on Al-Si alloy and polarization curves in 3.5 % NaCl solution, prepared by zinc baths with different amount of stabilizers. It could be concluded from potential and corrosion resistance of zinc platings that stabilizer could improve the stable potential and the corrosion resistance in 3.5 % NaC1 solution as well. The better stabilizer is stabilizer A, and the best amount of which is 0,05 g/L-0.1 g/L. Scanning electron microscope (SEM) and electron despersive spectrum (EDS) were used to analyze the micromorphology and composition of zinc platings and EN deposit. The adhesion of EN deposits to the substrate is qualified. The role of stabilizer is also discussed.
关 键 词:稳定剂 浸锌溶液 浸锌时间 浸锌活化电位 极化曲线
分 类 号:TQ153[化学工程—电化学工业]
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