瞬间液相扩散焊过程中的接触熔化与等温凝固模型  

MODEL OF CONTACT-MELTING AND ISOTHERMAL SOLIDIFICATION DURING TRANSIENT LIQUID PHASE DIFFUSION BONDING

作　　者：王艳芳[1] 李京龙[1] 

机构地区：[1]西北工业大学摩擦焊接陕西省重点实验室,西安市710072

出　　处：《焊接》2006年第7期7-11,共5页Welding & Joining

摘　　要：接触熔化与等温凝固是瞬间液相扩散焊过程中两个非常重要的阶段,是获得优质连接接头的关键,一直以来也是学术界研究的热点。综述了接触熔化与等温凝固过程的动力学模型,包括接触熔化与等温凝固时间的解析解,接触熔化过程中反应层厚度与连接时间符合扩散控制的抛物线规则,以及等温凝固过程中液/固界面迁移的速度方程。并对现有模型进行了分析和讨论。Contact-melting and isothermal solidification are two important stages in transient liquid phase diffusion bonding process, which are the key factors that affect the properties of the joint and become the hot topic in the research field. The kinetic models of contact-melting and isothermal solidification were summarized, analyzed and discussed, which included the analytic results of contact-melting and isothermal solidification, the parabolic rule controlled by diffusion to describe the relationship of the thickness of reaction layer and solidification time during melting as well as the migration equation of liquid/solid interface during the isothermal solidification.

关 键 词：瞬间液相扩散焊 接触熔化 等温凝固 模型 

分 类 号：TG453.9[金属学及工艺—焊接] TN305.93[电子电信—物理电子学]